- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
Patent holdings for IPC class H01L 21/18
Total number of patents in this class: 721
10-year publication summary
|
63
|
49
|
62
|
70
|
58
|
60
|
40
|
51
|
62
|
17
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Soitec | 892 |
63 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
46 |
| EV Group E. Thallner GmbH | 376 |
45 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
37 |
| Tokyo Electron Limited | 11599 |
26 |
| Samsung Electronics Co., Ltd. | 131630 |
17 |
| International Business Machines Corporation | 60644 |
17 |
| Infineon Technologies AG | 8189 |
14 |
| Intel Corporation | 45621 |
12 |
| S.O.I.Tec Silicon on Insulator Technologies | 293 |
11 |
| Kioxia Corporation | 9847 |
11 |
| Invensas Bonding Technologies, Inc. | 150 |
10 |
| Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. | 155 |
9 |
| Micron Technology, Inc. | 24960 |
8 |
| CAES Colorado Springs LLC | 52 |
8 |
| The Regents of the University of California | 18943 |
7 |
| Applied Materials, Inc. | 16587 |
7 |
| Massachusetts Institute of Technology | 9795 |
7 |
| 3-5 Power Electronics GmbH | 19 |
7 |
| Adeia Semiconductor Bonding Technologies Inc. | 185 |
7 |
| Other owners | 352 |